Authors:
HibaMudhafarHashim,Ihsan Y. Hussain,DOI NO:
http://doi.org/10.26782/jmcms.2019.10.00006Keywords:
PCB,Perforated Fins Heat Sink,Inclination,Vibration,Natural Convection.,Abstract
A numerical simulation is proposed to investigate the thermal behavior ofa Central Processer Unit (CPU) as a single electronic component placed on Printed Circuit Board (PCB) equipped with a heat sink. Two types of heat sinks were used; the first is with solid fins and the other with perforated fins. Natural convection cooling is considered, with the inclusion of vibration and inclination effects. The power dissipated from the electronic component is (30W). In order to study the thermal behavior during the vibration effect, a frequency values of (0,2,5,9,16HZ) with constant amplitude (3 mm) was considered. The inclination effect is investigated with and without the vibration effect. The results showed that the vibration causesa decrease in the temperature of the component. The temperature of the component decreases with increasing the angle of inclination, Verification of the results gave good agreement.Refference:
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